2022-03-07

Fan-out wafer-level packaging (FOWLP) is a cost-effective way to achieve high interconnect density and to manage larger I/O counts within an affordable package.

2022-2-05

什么是扇出型封装？扇出型封装技术在封装市场是较为热门的话题。在扇出型技术中，裸片直接在晶圆上封装。由于扇出型技术并不需要中介层（interposer)，因此比2.5D/3D封装器件更廉价。

2022-01-17

For many years the semiconductor industry’s wafer fabrication facilities, where semiconductor devices are manufactured on [principally] silicon substrates, have universally embraced and mandated the GEM standard on nearly 100% of the production equipment.